UClamp3304A Datasheet by Semtech Corporation

a SEMTECH —
PROTECTION PRODUCTS
1www.semtech.com
PROTECTION PRODUCTS - MicroClampTM
uClamp3304A
µClampTM
4-Line ESD protection Array
Description Features
Dimensions Schematic & PIN Configuration
Revision 01/18/08
The µClampTM series of TVS arrays are designed to pro-
tect sensitive electronics from damage or latch-up due
to ESD. They are designed for use in applications where
board space is at a premium. Each device requires less
than 2.9mm2 of PCB area and will protect up to four
lines. They are unidirectional devices and may be used
on lines with positive signal polarities.
The µclampTM3304A is constructed using Semtech’s pro-
prietary EPD process technology. The EPD process pro-
vides low standoff voltages with significant reductions in
leakage currents and capacitance over silicon-avalanche
diode processes. They feature a true operating voltage
of 3.3 volts for superior protection when compared to
traditional pn junction devices.
These devices may be used to meet the immunity re-
quirements of IEC 61000-4-2, level 4. They offer desir-
able characteristics for board level protection including
fast response time, low operating and clamping voltage,
and no device degradation. The small SC89 package
makes them ideal for use in portable electronics such as
cell phones, PDAs, notebook computers, and digital cam-
eras. Applications
Mechanical Characteristics
Cellular Handsets and Accessories
Cordless Phones
Notebooks and Handhelds
Portable Instrumentation
Digital Cameras
Peripherals
MP3 Players
Transient protection for data lines to
IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Protects four unidirectional I/O lines
Ultra-small SC-89 package (1.7 x 1.7 x 0.6mm1.7 x 1.7 x 0.6mm
1.7 x 1.7 x 0.6mm1.7 x 1.7 x 0.6mm
1.7 x 1.7 x 0.6mm)
requires less than 2.9mm2 of PCB area
Working voltage: 3.3V
Low leakage current
Low operating and clamping voltages
Solid-state silicon-avalanche technology
SC-89 (SOT-666) package
Molding compound flammability rating: UL 94V-0
Marking: Marking Code
Lead Finish: Matte Tin
RoHS Compliant
Weight: 2.9mg (typical)
Packaging: Tape and Reel
SC-89 (Top View)
0.60
1.70
1.701.25
0.30
0.50
Maximum Dimensions (mm)
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22008 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
µClamp3304A
Absolute Maximum Rating
Electrical Characteristics (T=25oC)
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PROTECTION PRODUCTS
µClamp3304A
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
0
10
20
30
40
50
60
70
80
90
100
110
0 255075100125150
Ambient Temperature - TA (oC)
% of Rated Power or IPP
Power Derating Curve
Clamping Voltage vs. Peak Pulse Current Junction Capacitance vs. Reverse Voltage
Forward Voltage vs Forward Current ESD Clamping
(8kV Contact per IEC 61000-4-2)
0.0
5.0
10.0
15.0
20.0
25.0
00.511.522.533.5
Reverse Voltage - VR (V)
Capacitance - Cj (pF)
f = 1 MHz
0
2
4
6
8
10
12
012345
Peak Pulse Current - IPP (A)
Clamping Voltage - VC (V)
Waveform
Parameters:
tr = 8µs
td = 20µs
0.01
0.1
1
0.1 1 10 100 1000
Pulse Duration - tp (µs)
Peak Pulse Power - PPP (kW)
0
1
2
3
4
5
6
7
0123456
Forward Current - IF (A)
Forward Voltage - VF (V)
Waveform
Parameters:
tr = 8µs
td = 20µs
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42008 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
µClamp3304A
Circuit Diagram
Protection of Four Unidirectional Lines
Device Connection for Protection of Four Data Lines
These devices are designed to protect up to four
unidirectional data lines. The device is connected as
follows:
1. Unidirectional protection of four I/O lines is
achieved by connecting pins 1, 3, 4, and 6 to the
data lines. Pins 2 and 5 are connected to ground.
The ground connection should be made directly to
the ground plane for best results. The path length
is kept as short as possible to reduce the effects
of parasitic inductance in the board traces.
Due to the “snap-back” characteristics of the low
voltage TVS, it is not recommended that any of the I/O
lines be directly connected to a DC source greater than
snap-back votlage (VSB) as the device can latch on as
described below.
EPD TVS Characteristics
The SMF3.3 is constructed using Semtech’s propri-
etary EPD technology. The structure of the EPD TVS is
vastly different from the traditional pn-junction devices.
At voltages below 5V, high leakage current and junction
capacitance render conventional avalanche technology
impractical for most applications. However, by utilizing
the EPD technology, the SMF3.3 can effectively oper-
ate at 3.3V while maintaining excellent electrical
characteristics.
The EPD TVS employs a complex nppn structure in
contrast to the pn structure normally found in tradi-
tional silicon-avalanche TVS diodes. Since the EPD
TVS devices use a 4-layer structure, they exhibit a
slightly different IV characteristic curve when compared
to conventional devices. During normal operation, the
device represents a high-impedance to the circuit up to
the device working voltage (VRWM). During an ESD
event, the device will begin to conduct and will enter a
low impedance state when the punch through voltage
(VPT) is exceeded. Unlike a conventional device, the low
voltage TVS will exhibit a slight negative resistance
characteristic as it conducts current. This characteris-
tic aids in lowering the clamping voltage of the device,
but must be considered in applications where DC
voltages are present.
Applications Information
2, 5
1346
When the TVS is conducting current, it will exhibit a
slight “snap-back” or negative resistance characteris-
tics due to its structures. This point is defined on the
curve by the snap-back voltage (VSB) and snap-back
current (ISB). To return to a non-conducting state, the
current through the device must fall below the ISB
(approximately <50mA) and the voltage must fall below
the VSB (normally 2.8 volts for a 3.3V device). If a 3.3V
TVS is connected to 3.3V DC source, it will never fall
below the snap-back voltage of 2.8V and will therefore
stay in a conducting state.
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2008 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
µClamp3304A
Typical Applications
uClamp3304A
Circuit Board Layout Recommendations for Suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of ESD induced transients. The following guidelines are
recommended:
zPlace the TVS near the input terminals or connec-
tors to restrict transient coupling.
zMinimize the path length between the TVS and the
protected line.
zMinimize all conductive loops including power and
ground loops.
zThe ESD transient return path to ground should be
kept as short as possible.
zNever run critical signals near board edges.
zUse ground planes whenever possible.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
62008 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
µClamp3304A
Applications Information - Spice Model
Figure 1 - µClamp3304A Spice Model
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PROTECTION PRODUCTS
µClamp3304A
Outline Drawing - SC-89 (SOT-666)
Land Pattern - SC-89 (SOT-666)
INCHES
.063
N
c
E1
E
L
D .059
.043
DIM
A
MIN
.019
1.70
1.25
1.50
1.10
6
-
.008
.063
.047
.067
.049
6
-
0.20
1.60
1.20
1.60
MILLIMETERS
MAX
0.60
MIN
DIMENSIONS
MAXNOM
-.024
NOM
0.50 -
1
A
B
C
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
NOTES:
OR GATE BURRS.
DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
2.
1.
1.701.55.061 .067
0.300.10.012.003
L1 .003 .006 0.150.10.008 0.20
b .005 --
0.15.012 0.30
e.020 BSC 0.50 BSC
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NOTES:
1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
DIM
Y
Z
G
X
C
MILLIMETERSINCHES
(1.45)
.033
.090
.012
.024
(.057)
0.85
2.30
0.30
0.60
DIMENSIONS
Z
X
Y
CG
Y
P 0.50.020
P
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82008 Semtech Corp. www.semtech.com
PROTECTION PRODUCTS
µClamp3304A
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
Marking Code Ordering Information
Note:
(1) Device is symmetrical so there is no pin 1 identifier
Tape and Reel Specification
Tape Specifications and Device Orientation
Note: Lead finish is lead-free matte tin
MicroClamp, uClamp and µClamp are trademarks of Semtech
Corporation
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