ATS-CP Series Liquid Cold Plates

For cooling IGBT modules and high-powered semiconductors, air cooling is often inadequate and liquid cooling is required. Cold plates are a way to implement localized cooling of power electronics by transferring heat from the device to a liquid that flows to a remote heat exchanger and dissipates into either the ambient or to another liquid in a secondary cooling system. Advanced Thermal Solutions, Inc. (ATS) liquid cold plates are the right choice for cooling high-powered electronics, IGBT modules, lasers, wind turbines, motor devices, automotive components, medical equipment, and any application where liquid cooling is needed.

The internal, mini-channel fin structure enhances the surface area to maximize heat transfer with low pressure drop characteristics and provides uniform cold plate surface temperature.

Resources

• Engineering eBook: Liquid Cooling

Features and Benefits

• More than 30% improvement in thermal performance compared to commercially available cold plates
• Compatible with industry accepted coolants
• ¼ (pipe size) - 18 (thread density) NPT threaded input and output
• Low pressure drop
• Lightweight for ease of transportation
• Provides uniform cold plate surface temperature when IGBTs are installed
• Leak tested at 100 psi
• Customizable to fit different devices