STMicroelectronics

SH32N65DM6AG Automotive-Grade STPOWER MOSFET MDmesh™ DM6 Series

STMicroelectronics' device combines two MOSFETs in a half-bridge topology design, which enables several configurations

Image of STMicroelectronics SH32N65DM6AG Automotive-Grade STPOWER MOSFET MDmesh DM6 SeriesSTMicroelectronics' SH32N65DM6AG device combines two MOSFETs in a half-bridge topology. The ACEPACK SMIT is a compact and rugged power module in a surface-mount package for easy assembly. Thanks to the direct bond copper (DBC) substrate, the ACEPACK SMIT package offers low thermal resistance and an isolated top-side thermal pad. The high design flexibility of the package enables several configurations, including phase legs, boost, and single switch, through different combinations of internal power switches.

Features
  • AQG 324 qualified
  • Half-bridge power module
  • 650 V blocking voltage
  • Fast recovery body diode
  • Very low switching energies
  • Low package inductance
  • Dice on DBC substrate
  • Low thermal resistance
  • Isolation rating of 3.4 kVRMS/min

SH32N65DM6AG Automotive-Grade STPOWER MOSFET MDmesh™ DM6 Series

ImageManufacturer Part NumberDescriptionTechnologyConfigurationAvailable QuantityPriceView Details
MOSFET 2N-CH 650V 32A 9ACEPACKSH32N65DM6AGMOSFET 2N-CH 650V 32A 9ACEPACKMOSFET (Metal Oxide)2 N-Channel (Half Bridge)192 - Immediate$1,085.60View Details
Published: 2023-07-17