Shown on this slide is how the C553x makes audio and voice applications, including headsets, speakers, and speakerphones more affordable, while upgrading the user experience. For customers to provide a differentiated product in these applications there is a need for a processor that can provide sophisticated signal processing. They need fast time to market in order to succeed, along with maximum options for targeted peripherals and connectivity. All of this while being cost and size efficient. The C553x DSPs are ideal for these applications because TI has a very efficient signal processing machine which features up to 100 MHz operation along with options of scaling up to 320 Kb on-chip memory. Texas Instruments also provides abundant software resources, not just considering the development need but also the time to market for the customers in these target applications. TI has industry standard audio and voice codecs and advanced algorithms like acoustic echo removal, noise reduction and also complete framework for USB audio class development with full duplex performance and HIB capability. The other aspect which caters to these applications, is the integrated high speed USB 2.0 with PHY, adding USB connectivity without increasing the BOM cost or size, and the ability to run a Bluetooth stack for enabling wireless operation as well. The digital as well as analog integration, including power management and SAR ADCs, helps keep the size and cost low. Another way TI helps to reduce the overall system cost is with the 0.8 mm 12 mm x 12 mm package, which allows designers to use a 4-layer PCB instead of a 6-layer one. The C553x offers a complete and optimal hardware and software solution aimed at the audio and voice applications like USB headsets, speakers, microphones, as well as speakerphones.